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三星电子设备解决方案DS）部门已着手开发下一代封装材料“玻璃中介层”，目标不仅是取代昂贵的硅中介层，还要提升芯片性能。据报导，三星电子最近收到澳洲材料商Chemtronics和南韩设备商Philopt

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近日，宁夏金莱特新材料科技有限公司举行绿色环保型玻璃容器包装材料）一期项目投产暨三期项目开工启动仪式，据介绍该企业项目共分为三期建设，占地面积205亩，总投资15亿元。一期项目投资5.4亿元，建设两座

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